Granted Patent
Utility
US 5,571,373 · App. 08/245,592
Method of rough polishing semiconductor wafers to reduce surface roughness
Inventors:
Vepa Krishna, Michael S. Wisnieski, Lois Illig
Patented Case
View Patent ↗
Granted: Nov 5, 1996
Filed: May 18, 1994
Inventors
Vepa Krishna
Michael S. Wisnieski
Lois Illig
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.