IP Library Granted Patent US 5,571,753
Granted Patent Utility
US 5,571,753 · App. 08/455,086

Method for forming a wiring conductor in semiconductor device

Inventor: Masaru Saruwatari
Patented Case View Patent ↗
Granted: Nov 5, 1996 Filed: May 31, 1995
Inventor
Masaru Saruwatari
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,571,753
App. No.
08/455,086
Filed
1995-05-31
Granted
1996-11-05
Kind
A