Granted Patent
Utility
US 5,572,065 · App. 08/328,338
Hermetically sealed ceramic integrated circuit heat dissipating package
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Nov 5, 1996
Filed: Oct 24, 1994
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.