Granted Patent
Utility
US 5,573,680 · App. 08/283,782
Method for etching a semiconductor material without altering flow pattern defect distribution
Inventors:
Roger W. Shaw, Joseph C. Holzer
Patented Case
View Patent ↗
Granted: Nov 12, 1996
Filed: Aug 1, 1994
Inventors
Roger W. Shaw
Joseph C. Holzer
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.