IP Library Granted Patent US 5,578,261
Granted Patent Utility
US 5,578,261 · App. 08/289,327

Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling

Inventors: Louis Thomas Manzione, John D. Weld
Patented Case View Patent ↗
Granted: Nov 26, 1996 Filed: Aug 11, 1994
Inventors
Louis Thomas Manzione
John D. Weld
Assignee (at issue)
LUCENT TECHNOLOGIES INC.

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Quick Facts
Patent No.
US 5,578,261
App. No.
08/289,327
Filed
1994-08-11
Granted
1996-11-26
Kind
A