Granted Patent
Utility
US 5,579,573 · App. 08/320,812
Method for fabricating an undercoated chip electrically interconnected to a substrate
Inventors:
Jay DeAvis Baker, Cuong Pham, Robert Edward Belke
Patented Case
View Patent ↗
Granted: Dec 3, 1996
Filed: Oct 11, 1994
Inventors
Jay DeAvis Baker
Cuong Pham
Robert Edward Belke
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.