Granted Patent
Utility
US 5,582,772 · App. 08/485,936
Copper oxide-filled polymer die attach adhesive composition for semiconductor package
Inventor:
Cheol W. Kwak
Patented Case
View Patent ↗
Granted: Dec 10, 1996
Filed: Jun 7, 1995
Inventor
Cheol W. Kwak
Assignees (at issue)
LP INDUSTRIES LLC
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.