IP Library › Granted Patent US 5,583,378
Granted Patent Utility
US 5,583,378 · App. 08/245,146

Ball grid array integrated circuit package with thermal conductor

Inventors: Robert C. Marrs, Ronald J. Molnar
Patented Case View Patent ↗
Granted: Dec 10, 1996 Filed: May 16, 1994
Inventors
Robert C. Marrs
Ronald J. Molnar
Assignee (at issue)
Amkor Electronics, Inc.

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Quick Facts
Patent No.
US 5,583,378
App. No.
08/245,146
Filed
1994-05-16
Granted
1996-12-10
Kind
A