Granted Patent
Utility
US 5,585,668 · App. 08/601,880
Integrated circuit package with overlapped die on a common lead frame
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Dec 17, 1996
Filed: Feb 15, 1996
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.