Granted Patent
Utility
US 5,585,671 · App. 08/319,764
Reliable low thermal resistance package for high power flip clip ICs
Inventors:
Voddarahalli K. Nagesh, Kim Hong Chen, Cheng-Cheng Chang, Bahram Afshari, Jacques Leibovitz
Patented Case
View Patent ↗
Granted: Dec 17, 1996
Filed: Oct 7, 1994
Inventors
Voddarahalli K. Nagesh
Kim Hong Chen
Cheng-Cheng Chang
Bahram Afshari
Jacques Leibovitz
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.