Granted Patent
Utility
US 5,586,715 · App. 08/617,585
Method of making solder balls by contained paste deposition
Inventors:
Matthew K. Schwiebert, Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas
Patented Case
View Patent ↗
Granted: Dec 24, 1996
Filed: Mar 19, 1996
Inventors
Matthew K. Schwiebert
Donald T. Campbell
Matthew Heydinger
Robert E. Kraft
Hubert A. Vander Plas
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.