Granted Patent
Utility
US 5,587,882 · App. 08/521,480
Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
Inventor:
Chandrakant Patel
Patented Case
View Patent ↗
Granted: Dec 24, 1996
Filed: Aug 30, 1995
Inventor
Chandrakant Patel
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.