Granted Patent
Utility
US 5,587,883 · App. 08/557,667
Lead frame assembly for surface mount integrated circuit power package
Inventors:
Timothy L. Olson, Lauriann T. Carney, Gary Carl Johnson, William Strom
Patented Case
View Patent ↗
Granted: Dec 24, 1996
Filed: Nov 13, 1995
Inventors
Timothy L. Olson
Lauriann T. Carney
Gary Carl Johnson
William Strom
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.