Granted Patent
Utility
US 5,589,083 · App. 08/346,205
Method of manufacturing microstructure by the anisotropic etching and bonding of substrates
Inventors:
Kun-Young Ahn, Kyung-Ho Park, Kee-Soo Nam, Sang Won Kang
Patented Case
View Patent ↗
Granted: Dec 31, 1996
Filed: Nov 22, 1994
Inventors
Kun-Young Ahn
Kyung-Ho Park
Kee-Soo Nam
Sang Won Kang
Assignee (at issue)
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.