Granted Patent
Utility
US 5,589,402 · App. 08/550,416
Process for manufacturing a package for mating with a bare semiconductor die
Inventors:
Kenneth C. Ramsey, William J. Miller, William Strom
Patented Case
View Patent ↗
Granted: Dec 31, 1996
Filed: Oct 30, 1995
Inventors
Kenneth C. Ramsey
William J. Miller
William Strom
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.