Granted Patent
Utility
US 5,598,038 · App. 08/569,312
Resin encapsulated semiconductor device
Inventor:
Yoichi Sugano
Patented Case
View Patent ↗
Granted: Jan 28, 1997
Filed: Dec 8, 1995
Inventor
Yoichi Sugano
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.