Granted Patent
Utility
US 5,598,096 · App. 08/348,432
Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal
Inventors:
Cuong Pham, Brian John Hayden, Bethany J. Walles, Peter R. Cibirka
Patented Case
View Patent ↗
Granted: Jan 28, 1997
Filed: Dec 2, 1994
Inventors
Cuong Pham
Brian John Hayden
Bethany J. Walles
Peter R. Cibirka
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.