Granted Patent
Utility
US 5,601,902 · App. 08/443,298
Multilayer printed circuit boards and multichip-module substrates, with layers of amorphous hydrogenated carbon
Inventors:
Albert Hammerschmidt, Siegfried Birkle
Patented Case
View Patent ↗
Granted: Feb 11, 1997
Filed: May 17, 1995
Inventors
Albert Hammerschmidt
Siegfried Birkle
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.