Granted Patent
Utility
US 5,603,779 · App. 08/443,242
Bonded wafer and method of fabrication thereof
Inventors:
Jack H. Linn, George Bajor, George V. Rouse
Patented Case
View Patent ↗
Granted: Feb 18, 1997
Filed: May 17, 1995
Inventors
Jack H. Linn
George Bajor
George V. Rouse
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.