Granted Patent
Utility
US 5,604,376 · App. 08/269,294
Paddleless molded plastic semiconductor chip package
Inventors:
William Hamburgen, John S. Fitch, Yezdi Dordi
Patented Case
View Patent ↗
Granted: Feb 18, 1997
Filed: Jun 30, 1994
Inventors
William Hamburgen
John S. Fitch
Yezdi Dordi
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.