Granted Patent
Utility
US 5,605,600 · App. 08/402,378
Etch profile shaping through wafer temperature control
Inventors:
Karl Paul Muller, Klaus Roithner, Bernhard Poschenrieder, Toru Watanabe
Patented Case
View Patent ↗
Granted: Feb 25, 1997
Filed: Mar 13, 1995
Inventors
Karl Paul Muller
Klaus Roithner
Bernhard Poschenrieder
Toru Watanabe
Assignees (at issue)
International Business Machines Corporation
Siemens Aktiengesellschaft
Kabushiki Kaisha Toshiba
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.