Granted Patent
Utility
US 5,608,262 · App. 08/393,628
Packaging multi-chip modules without wire-bond interconnection
Inventors:
Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han, Alan Michael Lyons, King Lien Tai
Patented Case
View Patent ↗
Granted: Mar 4, 1997
Filed: Feb 24, 1995
Inventors
Yinon Degani
Thomas Dixon Dudderar
Byung Joon Han
Alan Michael Lyons
King Lien Tai
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.