Granted Patent
Utility
US 5,610,101 · App. 08/459,780
Method of manufacturing a semiconductor device having improved coverage with increased wiring layers
Inventor:
Kuniaki Koyama
Patented Case
View Patent ↗
Granted: Mar 11, 1997
Filed: Jun 2, 1995
Inventor
Kuniaki Koyama
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.