Granted Patent
Utility
US 5,610,440 · App. 08/605,896
Semiconductor devide having improved junction construction between heat radiation plate and ceramic substrate
Inventor:
Seiya Isozaki
Patented Case
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Granted: Mar 11, 1997
Filed: Feb 23, 1996
Inventor
Seiya Isozaki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.