Granted Patent
Utility
US 5,615,475 · App. 08/517,485
Method of manufacturing an integrated package having a pair of die on a common lead frame
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Apr 1, 1997
Filed: Aug 21, 1995
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.