Granted Patent
Utility
US 5,629,561 · App. 08/570,794
Semiconductor package with integral heat dissipator
Inventors:
Won Sun Shin, Byung Tai Do
Patented Case
View Patent ↗
Granted: May 13, 1997
Filed: Dec 12, 1995
Inventors
Won Sun Shin
Byung Tai Do
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.