Granted Patent
Utility
US 5,641,946 · App. 08/588,482
Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages
Inventor:
Il Kwon Shim
Patented Case
View Patent ↗
Granted: Jun 24, 1997
Filed: Jan 18, 1996
Inventor
Il Kwon Shim
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.