Granted Patent
Utility
US 5,641,992 · App. 08/513,494
Metal interconnect structure for an integrated circuit with improved electromigration reliability
Inventors:
Pei-Ing Lee, Bernd Vollmer, Darryl D. Restaino, Bill Klaasen
Patented Case
View Patent ↗
Granted: Jun 24, 1997
Filed: Aug 10, 1995
Inventors
Pei-Ing Lee
Bernd Vollmer
Darryl D. Restaino
Bill Klaasen
Assignees (at issue)
Siemens Components, Inc.
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.