Granted Patent
Utility
US 5,643,422 · App. 08/580,393
Reactive sputtering system for depositing titanium nitride without formation of titanium nitride on titanium target and process of depositing titanium nitride layer
Inventor:
Yoshiaki Yamada
Patented Case
View Patent ↗
Granted: Jul 1, 1997
Filed: Dec 28, 1995
Inventor
Yoshiaki Yamada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.