Granted Patent
Utility
US 5,643,802 · App. 08/634,443
Method of producing a semiconductor device by gang bonding followed by point bonding
Inventor:
Chikara Yamashita
Patented Case
View Patent ↗
Granted: Jul 1, 1997
Filed: Apr 18, 1996
Inventor
Chikara Yamashita
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.