Granted Patent
Utility
US 5,646,828 · App. 08/697,121
Thin packaging of multi-chip modules with enhanced thermal/power management
Inventors:
Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han, Alan Michael Lyons
Patented Case
View Patent ↗
Granted: Jul 8, 1997
Filed: Aug 20, 1996
Inventors
Yinon Degani
Thomas Dixon Dudderar
Byung Joon Han
Alan Michael Lyons
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.