Granted Patent
Utility
US 5,650,666 · App. 08/562,125
Method and apparatus for preventing cracks in semiconductor die
Inventors:
Marc D. Hartranft, Pat Zicolello
Patented Case
View Patent ↗
Granted: Jul 22, 1997
Filed: Nov 22, 1995
Inventors
Marc D. Hartranft
Pat Zicolello
Assignee (at issue)
Cypress Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.