Granted Patent
Utility
US 5,653,375 · App. 08/547,731
Wire bonding apparatus
Inventor:
Soo-keun Nam
Patented Case
View Patent ↗
Granted: Aug 5, 1997
Filed: Oct 26, 1995
Inventor
Soo-keun Nam
Assignee (at issue)
Samsung Aerospace Industries, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.