Granted Patent
Utility
US 5,654,081 · App. 08/498,207
Integrated circuit assembly with polymeric underfill body
Inventor:
Michael George Todd
Patented Case
View Patent ↗
Granted: Aug 5, 1997
Filed: Jul 5, 1995
Inventor
Michael George Todd
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.