Granted Patent
Utility
US 5,654,220 · App. 08/475,770
Method of making a stacked 3D integrated circuit structure
Inventor:
Glenn J. Leedy
Patented Case
View Patent ↗
Granted: Aug 5, 1997
Filed: Jun 7, 1995
Inventor
Glenn J. Leedy
Assignee (at issue)
Elm Technology Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.