Granted Patent
Utility
US 5,654,903 · App. 08/553,118
Method and apparatus for real time monitoring of wafer attributes in a plasma etch process
Inventors:
Edward A. Reitman, Dale E. Ibbotson, Tseng-Chung Lee
Patented Case
View Patent ↗
Granted: Aug 5, 1997
Filed: Nov 7, 1995
Inventors
Edward A. Reitman
Dale E. Ibbotson
Tseng-Chung Lee
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.