Granted Patent
Utility
US 5,655,700 · App. 08/494,217
Ultrasonic flip chip bonding process and apparatus
Inventors:
Cuong Pham, Brian John Hayden, Bethany J. Walles
Patented Case
View Patent ↗
Granted: Aug 12, 1997
Filed: Jun 23, 1995
Inventors
Cuong Pham
Brian John Hayden
Bethany J. Walles
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.