Granted Patent
Utility
US 5,656,851 · App. 08/443,623
Semiconductor wafer having slices and limited scribe areas for implementing die
Inventors:
Brian D. Hamilton, Joseph R. Pierret
Patented Case
View Patent ↗
Granted: Aug 12, 1997
Filed: May 18, 1995
Inventors
Brian D. Hamilton
Joseph R. Pierret
Assignee (at issue)
Elantec Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.