Granted Patent
Utility
US 5,656,860 · App. 08/494,645
Wiring structure for semiconductor device and fabrication method therefor
Inventor:
Chang Jae Lee
Patented Case
View Patent ↗
Granted: Aug 12, 1997
Filed: Jun 23, 1995
Inventor
Chang Jae Lee
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.