Granted Patent
Utility
US 5,658,190 · App. 08/573,430
Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
Inventors:
David Q. Wright, Mike Walker, Karl M. Robinson
Patented Case
View Patent ↗
Granted: Aug 19, 1997
Filed: Dec 15, 1995
Inventors
David Q. Wright
Mike Walker
Karl M. Robinson
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.