Granted Patent
Utility
US 5,658,381 · App. 08/439,022
Method to form hemispherical grain (HSG) silicon by implant seeding followed by vacuum anneal
Inventors:
Randhir P. S. Thakur, Michael Nuttall
Patented Case
View Patent ↗
Granted: Aug 19, 1997
Filed: May 11, 1995
Inventors
Randhir P. S. Thakur
Michael Nuttall
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.