IP Library › Granted Patent US 5,663,598
Granted Patent Utility
US 5,663,598 · App. 08/553,762

Electrical circuit bonding interconnect component and flip chip interconnect bond

Inventors: Rickie C. Lake, Mark E. Tuttle
Patented Case View Patent ↗
Granted: Sep 2, 1997 Filed: Oct 23, 1995
Inventors
Rickie C. Lake
Mark E. Tuttle
Assignee (at issue)
Micron Communications, Inc.

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Quick Facts
Patent No.
US 5,663,598
App. No.
08/553,762
Filed
1995-10-23
Granted
1997-09-02
Kind
A