IP Library › Granted Patent US 5,668,045
Granted Patent Utility
US 5,668,045 · App. 08/346,695

Process for stripping outer edge of BESOI wafers

Inventors: David Golland, Robert A. Craven, Ronald D. Bartram
Patented Case View Patent ↗
Granted: Sep 16, 1997 Filed: Nov 30, 1994
Inventors
David Golland
Robert A. Craven
Ronald D. Bartram
Assignee (at issue)
SiBond, L.L.C.

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Quick Facts
Patent No.
US 5,668,045
App. No.
08/346,695
Filed
1994-11-30
Granted
1997-09-16
Kind
A