Granted Patent
Utility
US 5,674,785 · App. 08/563,191
Method of producing a single piece package for semiconductor die
Inventors:
Salman Akram, Alan G. Wood, Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Oct 7, 1997
Filed: Nov 27, 1995
Inventors
Salman Akram
Alan G. Wood
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.