Granted Patent
Utility
US 5,677,239 · App. 08/164,579
Method for fabricating multi-level interconnection structure for semiconductor device
Inventor:
Akira Isobe
Patented Case
View Patent ↗
Granted: Oct 14, 1997
Filed: Dec 10, 1993
Inventor
Akira Isobe
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.