Granted Patent
Utility
US 5,684,333 · App. 08/571,513
Wafer structure in a semiconductor device manufacturing process
Inventor:
Norio Moriyama
Patented Case
View Patent ↗
Granted: Nov 4, 1997
Filed: Dec 13, 1995
Inventor
Norio Moriyama
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.