Granted Patent
Utility
US 5,686,743 · App. 08/679,637
Method of forming airbridged metallization for integrated circuit fabrication
Inventor:
Michael D. Lammert
Patented Case
View Patent ↗
Granted: Nov 11, 1997
Filed: Jul 10, 1996
Inventor
Michael D. Lammert
Assignee (at issue)
TRW Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.