Granted Patent
Utility
US 5,693,203 · App. 08/306,057
Sputtering target assembly having solid-phase bonded interface
Inventors:
Tateo Ohhashi, Hideaki Fukuyo, Ichiroh Sawamura, Kenichirou Nakamura, Atsushi Fukushima, Masaru Nagasawa
Patented Case
View Patent ↗
Granted: Dec 2, 1997
Filed: Sep 14, 1994
Inventors
Tateo Ohhashi
Hideaki Fukuyo
Ichiroh Sawamura
Kenichirou Nakamura
Atsushi Fukushima
Masaru Nagasawa
Assignee (at issue)
Japan Energy Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.