Granted Patent
Utility
US 5,696,027 · App. 08/463,703
Method of manufacturing a semiconductor chip carrier affording a high-density external interface
Inventors:
Stanford W. Crane, Jr., Maria M. Portuondo
Patented Case
View Patent ↗
Granted: Dec 9, 1997
Filed: Jun 5, 1995
Inventors
Stanford W. Crane, Jr.
Maria M. Portuondo
Assignee (at issue)
The Panda Project
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.