Granted Patent
Utility
US 5,698,160 · App. 08/705,035
Lead-free alloys for use in solder bonding
Inventors:
Ho S. Chen, Sungho Jin, Mark Thomas McCormack
Patented Case
View Patent ↗
Granted: Dec 16, 1997
Filed: Aug 29, 1996
Inventors
Ho S. Chen
Sungho Jin
Mark Thomas McCormack
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.